Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Takao Tanigawa, Tetsuroh Irino, Yuusuke Kondou, Etsuo Mizushima, Tomio Fukuda +2 more | 2022-03-29 |
| 11214660 | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate | Yuma Yoshida, Yukio Nakamura, Shinji Tsuchikawa, Katsuhiko Nawate, Shintaro Hashimoto | 2022-01-04 |