Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11446845 | Method for manufacturing FRP precursor and method for manufacturing FRP | Ryohta SASAKI, Yukio Nakamura, Kazutoshi Danjoubara, Takeshi Saitoh | 2022-09-20 |
| 11401381 | Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same | Tomohiko KOTAKE, Masato Miyatake, Shunsuke Nagai, Yasuo Inoue, Shin Takanezawa +1 more | 2022-08-02 |
| 11214660 | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate | Yuma Yoshida, Yuichi Shimayama, Yukio Nakamura, Shinji Tsuchikawa, Katsuhiko Nawate | 2022-01-04 |