Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401381 | Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same | Tomohiko KOTAKE, Masato Miyatake, Shunsuke Nagai, Shintaro Hashimoto, Shin Takanezawa +1 more | 2022-08-02 |