Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11214660 | Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate | Yuma Yoshida, Yuichi Shimayama, Yukio Nakamura, Katsuhiko Nawate, Shintaro Hashimoto | 2022-01-04 |