Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11497117 | Metal-clad laminate, printed wiring board and semiconductor package | Yuji TOSAKA, Takeshi Saitoh, Yukio Nakamura, Hiroshi Shimizu, Ryoichi UCHIMURA | 2022-11-08 |
| 11446845 | Method for manufacturing FRP precursor and method for manufacturing FRP | Yukio Nakamura, Kazutoshi Danjoubara, Takeshi Saitoh, Shintaro Hashimoto | 2022-09-20 |