Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11497117 | Metal-clad laminate, printed wiring board and semiconductor package | Takeshi Saitoh, Yukio Nakamura, Ryohta SASAKI, Hiroshi Shimizu, Ryoichi UCHIMURA | 2022-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11497117 | Metal-clad laminate, printed wiring board and semiconductor package | Takeshi Saitoh, Yukio Nakamura, Ryohta SASAKI, Hiroshi Shimizu, Ryoichi UCHIMURA | 2022-11-08 |