Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11359055 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Yasuyuki Mizuno, Yuki Nagai, Hikari Murai | 2022-06-14 |
| 11339251 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | Yuki Nagai, Tetsuroh Irino, Yuusuke Kondou, Etsuo Mizushima, Takao Tanigawa | 2022-05-24 |
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Takao Tanigawa, Tetsuroh Irino, Yuusuke Kondou, Yuichi Shimayama, Etsuo Mizushima +2 more | 2022-03-29 |