| 11205625 |
Wafer-level bonding of obstructive elements |
Rajesh Katkar |
2021-12-21 |
| 11169326 |
Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects |
Shaowu Huang, Liang Wang, Guilian Gao |
2021-11-09 |
| 11157670 |
Systems and methods for inter-die block level design |
Eric Nequist, Jung Ko, Kenneth Duong |
2021-10-26 |
| 11152336 |
3D processor having stacked integrated circuit die |
Steven Teig, Ilyas Mohammed, Kenneth Duong |
2021-10-19 |
| 11139283 |
Abstracted NAND logic in stacks |
Stephen L. Morein |
2021-10-05 |
| 11127738 |
Back biasing of FD-SOI circuit blocks |
David Edward Fisch, Kenneth Duong, Xu Chang, Liang Wang |
2021-09-21 |
| 11063017 |
Embedded organic interposer for high bandwidth |
Belgacem Haba |
2021-07-13 |
| 11024220 |
Formation of a light-emitting diode display |
Liang Wang, Rajesh Katkar, Ilyas Mohammed, Belgacem Haba |
2021-06-01 |
| 10998265 |
Interface structures and methods for forming same |
Shaowu Huang |
2021-05-04 |
| 10991804 |
Transistor level interconnection methodologies utilizing 3D interconnects |
David Edward Fisch |
2021-04-27 |
| 10991676 |
Systems and methods for flash stacking |
Belgacem Haba, Ilyas Mohammed |
2021-04-27 |
| 10978348 |
3D chip sharing power interconnect layer |
Steven Teig, Ilyas Mohammed |
2021-04-13 |
| 10970627 |
Time borrowing between layers of a three dimensional chip stack |
Steven Teig, Kenneth Duong |
2021-04-06 |
| 10950547 |
Stacked IC structure with system level wiring on multiple sides of the IC die |
Ilyas Mohammed, Steven Teig |
2021-03-16 |
| 10923413 |
Hard IP blocks with physically bidirectional passageways |
— |
2021-02-16 |
| 10923408 |
Cavity packages |
Shaowu Huang, Liang Wang, Rajesh Katkar, Belgacem Haba |
2021-02-16 |
| 10910344 |
Systems and methods for releveled bump planes for chiplets |
Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar, Ilyas Mohammed |
2021-02-02 |
| 10892252 |
Face-to-face mounted IC dies with orthogonal top interconnect layers |
Eric Nequist, Steven Teig, Ilyas Mohammed, Laura Mirkarimi |
2021-01-12 |
| 10886177 |
3D chip with shared clock distribution network |
Steven Teig, Ilyas Mohammed |
2021-01-05 |