Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11157670 | Systems and methods for inter-die block level design | Javier A. Delacruz, Jung Ko, Kenneth Duong | 2021-10-26 |
| 10892252 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Steven Teig, Javier A. Delacruz, Ilyas Mohammed, Laura Mirkarimi | 2021-01-12 |