Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892252 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Eric Nequist, Steven Teig, Javier A. Delacruz, Ilyas Mohammed | 2021-01-12 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892252 | Face-to-face mounted IC dies with orthogonal top interconnect layers | Eric Nequist, Steven Teig, Javier A. Delacruz, Ilyas Mohammed | 2021-01-12 |