Issued Patents 2021
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11210586 | Weight value decoder of neural network inference circuit | Jung Ko, Steven Teig | 2021-12-28 |
| 11205115 | Neural network inference circuit | Jung Ko, Steven Teig | 2021-12-21 |
| 11176450 | Three dimensional circuit implementing machine trained network | Steven Teig | 2021-11-16 |
| 11170289 | Computation of neural network node by neural network inference circuit | Jung Ko, Steven Teig | 2021-11-09 |
| 11157670 | Systems and methods for inter-die block level design | Javier A. Delacruz, Eric Nequist, Jung Ko | 2021-10-26 |
| 11152336 | 3D processor having stacked integrated circuit die | Steven Teig, Ilyas Mohammed, Javier A. Delacruz | 2021-10-19 |
| 11127738 | Back biasing of FD-SOI circuit blocks | Javier A. Delacruz, David Edward Fisch, Xu Chang, Liang Wang | 2021-09-21 |
| 11049013 | Encoding of weight values stored on neural network inference circuit | Jung Ko, Steven Teig | 2021-06-29 |
| 11003736 | Reduced dot product computation circuit | Jung Ko, Steven Teig | 2021-05-11 |
| 10977338 | Reduced-area circuit for dot product computation | Jung Ko, Steven Teig | 2021-04-13 |
| 10970627 | Time borrowing between layers of a three dimensional chip stack | Steven Teig, Javier A. Delacruz | 2021-04-06 |