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Interlayer connection of stacked microelectronic components |
Guilian Gao |
2021-11-09 |
| 11158606 |
Molded direct bonded and interconnected stack |
Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar |
2021-10-26 |
| 11063017 |
Embedded organic interposer for high bandwidth |
Javier A. Delacruz |
2021-07-13 |
| 11024220 |
Formation of a light-emitting diode display |
Liang Wang, Rajesh Katkar, Javier A. Delacruz, Ilyas Mohammed |
2021-06-01 |
| 11004930 |
High density three-dimensional integrated capacitors |
Vage Oganesian, Ilyas Mohammed, Piyush Savalia |
2021-05-11 |
| 10991676 |
Systems and methods for flash stacking |
Ilyas Mohammed, Javier A. Delacruz |
2021-04-27 |
| 10969593 |
Remote optical engine for virtual reality or augmented reality headsets |
Ilyas Mohammed, Rajesh Katkar |
2021-04-06 |
| 10955671 |
Stretchable film assembly with conductive traces |
Ilyas Mohammed, Gabriel Z. Guevara, Min Tao |
2021-03-23 |
| 10923408 |
Cavity packages |
Shaowu Huang, Javier A. Delacruz, Liang Wang, Rajesh Katkar |
2021-02-16 |
| 10910344 |
Systems and methods for releveled bump planes for chiplets |
Javier A. Delacruz, Cyprian Emeka Uzoh, Rajesh Katkar, Ilyas Mohammed |
2021-02-02 |