Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158573 | Interconnect structures | Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr. | 2021-10-26 |
| 11158606 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Belgacem Haba, Rajesh Katkar | 2021-10-26 |
| 11056348 | Bonding surfaces for microelectronics | — | 2021-07-06 |