| 11205625 |
Wafer-level bonding of obstructive elements |
Javier A. Delacruz |
2021-12-21 |
| 11158606 |
Molded direct bonded and interconnected stack |
Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba |
2021-10-26 |
| 11088099 |
Multi-metal contact structure in microelectronic component |
Cyprian Emeka Uzoh |
2021-08-10 |
| 11069734 |
Image sensor device |
— |
2021-07-20 |
| 11031285 |
Diffusion barrier collar for interconnects |
Cyprian Emeka Uzoh |
2021-06-08 |
| 11024220 |
Formation of a light-emitting diode display |
Liang Wang, Javier A. Delacruz, Ilyas Mohammed, Belgacem Haba |
2021-06-01 |
| 11011503 |
Direct-bonded optoelectronic interconnect for high-density integrated photonics |
Liang Wang |
2021-05-18 |
| 11011494 |
Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics |
Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Ilyas Mohammed, Cyprian Emeka Uzoh |
2021-05-18 |
| 11004757 |
Bonded structures |
Laura Wills Mirkarimi, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh |
2021-05-11 |
| 10969593 |
Remote optical engine for virtual reality or augmented reality headsets |
Belgacem Haba, Ilyas Mohammed |
2021-04-06 |
| 10923408 |
Cavity packages |
Shaowu Huang, Javier A. Delacruz, Liang Wang, Belgacem Haba |
2021-02-16 |
| 10910344 |
Systems and methods for releveled bump planes for chiplets |
Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Ilyas Mohammed |
2021-02-02 |