Issued Patents 2021
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205625 | Wafer-level bonding of obstructive elements | Javier A. Delacruz | 2021-12-21 |
| 11158606 | Molded direct bonded and interconnected stack | Guilian Gao, Cyprian Emeka Uzoh, Jeremy Alfred Theil, Belgacem Haba | 2021-10-26 |
| 11088099 | Multi-metal contact structure in microelectronic component | Cyprian Emeka Uzoh | 2021-08-10 |
| 11069734 | Image sensor device | — | 2021-07-20 |
| 11031285 | Diffusion barrier collar for interconnects | Cyprian Emeka Uzoh | 2021-06-08 |
| 11024220 | Formation of a light-emitting diode display | Liang Wang, Javier A. Delacruz, Ilyas Mohammed, Belgacem Haba | 2021-06-01 |
| 11011503 | Direct-bonded optoelectronic interconnect for high-density integrated photonics | Liang Wang | 2021-05-18 |
| 11011494 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics | Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Ilyas Mohammed, Cyprian Emeka Uzoh | 2021-05-18 |
| 11004757 | Bonded structures | Laura Wills Mirkarimi, Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2021-05-11 |
| 10969593 | Remote optical engine for virtual reality or augmented reality headsets | Belgacem Haba, Ilyas Mohammed | 2021-04-06 |
| 10923408 | Cavity packages | Shaowu Huang, Javier A. Delacruz, Liang Wang, Belgacem Haba | 2021-02-16 |
| 10910344 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Ilyas Mohammed | 2021-02-02 |