Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158573 | Interconnect structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2021-10-26 |
| 11037919 | Techniques for processing devices | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Guilian Gao | 2021-06-15 |
| 11011418 | 3D IC method and device | Paul M. Enquist, Qin-Yi Tong | 2021-05-18 |
| 11011494 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics | Guilian Gao, Laura Wills Mirkarimi, Rajesh Katkar, Ilyas Mohammed, Cyprian Emeka Uzoh | 2021-05-18 |
| 11004757 | Bonded structures | Rajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Cyprian Emeka Uzoh | 2021-05-11 |
| 10964664 | DBI to Si bonding for simplified handle wafer | Chandrasekhar Mandalapu, Guilian Gao | 2021-03-30 |
| 10896902 | Systems and methods for efficient transfer of semiconductor elements | Cyprian Emeka Uzoh, Paul M. Enquist | 2021-01-19 |