PE

Paul M. Enquist

IT Invensas Bonding Technologies: 2 patents #11 of 15Top 75%
Overall (2021): #124,673 of 548,734Top 25%
2
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
11011418 3D IC method and device Gaius Gillman Fountain, Jr., Qin-Yi Tong 2021-05-18
10896902 Systems and methods for efficient transfer of semiconductor elements Cyprian Emeka Uzoh, Gaius Gillman Fountain, Jr. 2021-01-19