QT

Qin-Yi Tong

IT Invensas Bonding Technologies: 1 patents #13 of 15Top 90%
📍 Beijing, NC: #21 of 30 inventorsTop 70%
Overall (2021): #297,472 of 548,734Top 55%
1
Patents 2021

Issued Patents 2021

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11011418 3D IC method and device Paul M. Enquist, Gaius Gillman Fountain, Jr. 2021-05-18