Issued Patents 2021
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195748 | Interconnect structures and methods for forming same | Laura Wills Mirkarimi | 2021-12-07 |
| 11158606 | Molded direct bonded and interconnected stack | Guilian Gao, Jeremy Alfred Theil, Belgacem Haba, Rajesh Katkar | 2021-10-26 |
| 11158573 | Interconnect structures | Gaius Gillman Fountain, Jr., Jeremy Alfred Theil | 2021-10-26 |
| 11088099 | Multi-metal contact structure in microelectronic component | Rajesh Katkar | 2021-08-10 |
| 11056390 | Structures and methods for reliable packages | Guilian Gao, Liang Wang, Hong Shen, Arkalgud R. Sitaram | 2021-07-06 |
| 11037919 | Techniques for processing devices | Laura Wills Mirkarimi, Guilian Gao, Gaius Gillman Fountain, Jr. | 2021-06-15 |
| 11031285 | Diffusion barrier collar for interconnects | Rajesh Katkar | 2021-06-08 |
| 11011494 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics | Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Rajesh Katkar, Ilyas Mohammed | 2021-05-18 |
| 11004757 | Bonded structures | Rajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Gaius Gillman Fountain, Jr. | 2021-05-11 |
| 10985133 | Die processing | — | 2021-04-20 |
| 10957661 | Interconnections for a substrate associated with a backside reveal | — | 2021-03-23 |
| 10910344 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Rajesh Katkar, Ilyas Mohammed | 2021-02-02 |
| 10896902 | Systems and methods for efficient transfer of semiconductor elements | Paul M. Enquist, Gaius Gillman Fountain, Jr. | 2021-01-19 |
| 10892246 | Structures and methods for low temperature bonding using nanoparticles | — | 2021-01-12 |
| 10886250 | Structures and methods for low temperature bonding using nanoparticles | — | 2021-01-05 |