Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114402 | Semiconductor device with backmetal and related methods | Michael J. Seddon, Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda | 2021-09-07 |
| 11075090 | Semiconductor packages and related methods | Yong Liu, Liangbiao CHEN | 2021-07-27 |
| 11075137 | High power module package structures | Jerome Teysseyre | 2021-07-27 |
| 11043420 | Fan-out wafer level packaging of semiconductor devices | George Chang, Gordon M. Grivna, Takashi Noma | 2021-06-22 |
| 10991670 | Semiconductor device assemblies including spacer with embedded semiconductor die | Yong Liu, Huibin Chen | 2021-04-27 |
| 10897821 | Method of making single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Chee Hiong CHEW, Francis J. Carney | 2021-01-19 |