Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127651 | High power module semiconductor package with multiple submodules | Jie Chang, Keunhyuk LEE, Jerome Tysseyre | 2021-09-21 |
| 10991670 | Semiconductor device assemblies including spacer with embedded semiconductor die | Yong Liu, Yusheng LIN | 2021-04-27 |