Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127651 | High power module semiconductor package with multiple submodules | Huibin Chen, Keunhyuk LEE, Jerome Tysseyre | 2021-09-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127651 | High power module semiconductor package with multiple submodules | Huibin Chen, Keunhyuk LEE, Jerome Tysseyre | 2021-09-21 |