Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043420 | Fan-out wafer level packaging of semiconductor devices | Yusheng LIN, Gordon M. Grivna, Takashi Noma | 2021-06-22 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11043420 | Fan-out wafer level packaging of semiconductor devices | Yusheng LIN, Gordon M. Grivna, Takashi Noma | 2021-06-22 |