Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164835 | Semiconductor wafer and method of ball drop on thin wafer with edge support ring | Michael J. Seddon, Kazuhiro Saito | 2021-11-02 |
| 11114402 | Semiconductor device with backmetal and related methods | Michael J. Seddon, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda, Yusheng LIN | 2021-09-07 |
| 11075103 | Backside wafer alignment methods | Michael J. Seddon | 2021-07-27 |
| 11043420 | Fan-out wafer level packaging of semiconductor devices | George Chang, Yusheng LIN, Gordon M. Grivna | 2021-06-22 |
| 11032904 | Interposer substrate and circuit module | Hirokazu Yazaki, Keito Yonemori, Takanori Tsuchiya, Koji KAMADA | 2021-06-08 |
| 10896819 | Backside metal photolithographic patterning die singulation systems and related methods | Michael J. Seddon | 2021-01-19 |