Issued Patents 2021
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211359 | Semiconductor device and method of forming modular 3D semiconductor package with horizontal and vertical oriented substrates | Francis J. Carney | 2021-12-28 |
| 11164835 | Semiconductor wafer and method of ball drop on thin wafer with edge support ring | Takashi Noma, Kazuhiro Saito | 2021-11-02 |
| 11152211 | Semiconductor wafer thinning systems and related methods | Thomas Neyer | 2021-10-19 |
| 11127634 | Backside metal removal die singulation systems and related methods | — | 2021-09-21 |
| 11121035 | Semiconductor substrate processing methods | — | 2021-09-14 |
| 11114343 | Partial backside metal removal singulation system and related methods | — | 2021-09-07 |
| 11114402 | Semiconductor device with backmetal and related methods | Takashi Noma, Kazuo Okada, Hideaki Yoshimi, Naoyuki Yomoda, Yusheng LIN | 2021-09-07 |
| 11114329 | Methods for loading or unloading substrate with evaporator planet | Heng Chen Lee | 2021-09-07 |
| 11075118 | Semiconductor die singulation methods | — | 2021-07-27 |
| 11075129 | Substrate processing carrier | — | 2021-07-27 |
| 11075103 | Backside wafer alignment methods | Takashi Noma | 2021-07-27 |
| 11069585 | Semiconductor substrate crack mitigation systems and related methods | — | 2021-07-20 |
| 11049833 | Semiconductor packages with an intermetallic layer | Francis J. Carney | 2021-06-29 |
| 11043422 | Jet ablation die singulation systems and related methods | — | 2021-06-22 |
| 11018092 | Thinned semiconductor wafer | — | 2021-05-25 |
| 10998182 | Semiconductor wafer and method of wafer thinning | — | 2021-05-04 |
| 10964596 | Backside metal patterning die singulation system and related methods | — | 2021-03-30 |
| 10957597 | Semiconductor substrate die sawing singulation systems and methods | — | 2021-03-23 |
| 10950534 | Through-substrate via structure and method of manufacture | Francis J. Carney | 2021-03-16 |
| 10903154 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Francis J. Carney | 2021-01-26 |
| 10896819 | Backside metal photolithographic patterning die singulation systems and related methods | Takashi Noma | 2021-01-19 |
| 10896840 | Tape heating methods | — | 2021-01-19 |
| 10896815 | Semiconductor substrate singulation systems and related methods | Thomas Neyer, Fredrik Allerstam | 2021-01-19 |