Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11166386 | Interposer substrate, circuit module, and interposer substrate manufacturing method | Hirokazu Yazaki, Takanori Tsuchiya, Koji KAMADA | 2021-11-02 |
| 11032904 | Interposer substrate and circuit module | Hirokazu Yazaki, Takanori Tsuchiya, Koji KAMADA, Takashi Noma | 2021-06-08 |
| 11024571 | Coil built-in multilayer substrate and power supply module | — | 2021-06-01 |
| 10964645 | Electronic component with thin-film shield layer | Hirokazu Yazaki | 2021-03-30 |