Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177203 | Vertical and horizontal circuit assemblies | Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro, Maria Cristina Estacio | 2021-11-16 |
| 11145571 | Heat transfer for power modules | Inpil Yoo, Seungwon IM, Dongwook Kang | 2021-10-12 |
| 11075137 | High power module package structures | Yusheng LIN | 2021-07-27 |
| 11004777 | Semiconductor device assemblies | Chung-Lin Wu, Bigildis Dosdos | 2021-05-11 |
| 10910297 | Package including multiple semiconductor devices | Maria Cristina Estacio, Seungwon IM | 2021-02-02 |