Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177203 | Vertical and horizontal circuit assemblies | Jerome Teysseyre, Romel N. Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro | 2021-11-16 |
| 11088046 | Semiconductor device package with clip interconnect and dual side cooling | Elsie Agdon Cabahug, Romel N. Manatad | 2021-08-10 |
| 10943855 | Electronic device packaging with galvanic isolation | Marlon Bartolo, Maria Clemens Y. Quinones, Chung-Lin Wu | 2021-03-09 |
| 10910297 | Package including multiple semiconductor devices | Jerome Teysseyre, Seungwon IM | 2021-02-02 |