Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177203 | Vertical and horizontal circuit assemblies | Jerome Teysseyre, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian V. Almagro, Maria Cristina Estacio | 2021-11-16 |
| 11088046 | Semiconductor device package with clip interconnect and dual side cooling | Maria Cristina Estacio, Elsie Agdon Cabahug | 2021-08-10 |