Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2021-12-14 | $39,059,000 |
| 11145571 | Heat transfer for power modules | Inpil Yoo, Jerome Teysseyre, Dongwook Kang | 2021-10-12 | $28,470,000 |
| 11101198 | Semiconductor die package including a one-body clip | Joonseo SON, Oseob Jeon | 2021-08-24 | $27,734,000 |
| 11037907 | Semiconductor package and related methods | Oseob Jeon, Joonseo SON, Mankyo Jong, Olaf Zschieschang | 2021-06-15 | $16,180,000 |
| 11031379 | Stray inductance reduction in packaged semiconductor devices | Byoungok LEE, Oseob Jeon | 2021-06-08 | $33,252,000 |
| 11004698 | Power module package | Keunhyuk LEE, Oseob Jeon, Joon-seo Son | 2021-05-11 | $29,862,000 |
| 10910297 | Package including multiple semiconductor devices | Jerome Teysseyre, Maria Cristina Estacio | 2021-02-02 | $30,576,000 |