Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON +1 more | 2021-12-14 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Joonseo SON +1 more | 2021-12-14 |