Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Seungwon IM, Byoungok LEE, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2021-12-14 |
| 11101198 | Semiconductor die package including a one-body clip | Seungwon IM, Joonseo SON | 2021-08-24 |
| 11037907 | Semiconductor package and related methods | Seungwon IM, Joonseo SON, Mankyo Jong, Olaf Zschieschang | 2021-06-15 |
| 11031379 | Stray inductance reduction in packaged semiconductor devices | Seungwon IM, Byoungok LEE | 2021-06-08 |
| 11004698 | Power module package | Keunhyuk LEE, Joon-seo Son, Seungwon IM | 2021-05-11 |