Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Seungwon IM, Oseob Jeon, Yoonsoo LEE, Joonseo SON, Dukyong LEE +1 more | 2021-12-14 |
| 11031379 | Stray inductance reduction in packaged semiconductor devices | Seungwon IM, Oseob Jeon | 2021-06-08 |