Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201105 | Semiconductor package having a spacer with a junction cooling pipe | Seungwon IM, Oseob Jeon, Byoungok LEE, Yoonsoo LEE, Dukyong LEE +1 more | 2021-12-14 |
| 11101198 | Semiconductor die package including a one-body clip | Seungwon IM, Oseob Jeon | 2021-08-24 |
| 11037907 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Mankyo Jong, Olaf Zschieschang | 2021-06-15 |