Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081828 | Power module housing | Jihwan Kim, Yushuang YAO, Bosung WON, Atapol Prajuckamol | 2021-08-03 |
| 11037907 | Semiconductor package and related methods | Seungwon IM, Oseob Jeon, Joonseo SON, Mankyo Jong | 2021-06-15 |
| D922329 | Press-fit pin case | Jihwan Kim, Yushuang YAO, Bosung WON, Atapol Prajuckamol | 2021-06-15 |