Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11121055 | Leadframe spacer for double-sided power module | Tzu-Hsuan Cheng, Yong Liu | 2021-09-14 | $36,534,000 |
| 11075090 | Semiconductor packages and related methods | Yong Liu, Yusheng LIN | 2021-07-27 | $17,457,000 |