Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971428 | Semiconductor baseplates | Atapol Prajuckamol, Francis J. Carney, Yushuang YAO | 2021-04-06 |
| 10966335 | Fin frame assemblies | Atapol Prajuckamol, Yushuang YAO | 2021-03-30 |
| 10916485 | Molded wafer level packaging | Soon Wei WANG, Jin Yoong LIONG, Francis J. Carney | 2021-02-09 |
| 10897821 | Method of making single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Francis J. Carney, Yusheng LIN | 2021-01-19 |