Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11076491 | Integrated electro-optical flexible circuit board | Kelvin Po Leung Pun, Jason Rotanson | 2021-07-27 |
| 11069606 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Kelvin Po Leung Pun | 2021-07-20 |
| 10923449 | Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect | Kelvin Po Leung Pun | 2021-02-16 |
| 10917973 | Method of direct embedding a lithium ion battery on a flexible printed circuit board | Kelvin Po Leung Pun, Jason Rotanson, Wing Lung Hon, Yam Chong, Wai Yin Wong +2 more | 2021-02-09 |