Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10971429 | Method for forming a semiconductor package | Atapol Prajuckamol, Hoe Kit Liew How Kat Ley | 2021-04-06 | $16,674,000 |
| 10930604 | Ultra-thin multichip power devices | Nurul Nadiah Manap, Shutesh Krishnan | 2021-02-23 | $43,136,000 |
| 10916485 | Molded wafer level packaging | Jin Yoong LIONG, Chee Hiong CHEW, Francis J. Carney | 2021-02-09 | $74,756,000 |