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Hoe Kit Liew How Kat Ley

ON onsemi: 1 patents #93 of 370Top 30%
Overall (2021): #430,843 of 548,734Top 80%
1
Patents 2021

Issued Patents 2021

Patent #TitleCo-InventorsDate
10971429 Method for forming a semiconductor package Atapol Prajuckamol, Soon Wei WANG 2021-04-06