Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201107 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Teruo Okina, Akio Nishida | 2021-12-14 |
| 11195857 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Ching-Huang Lu, Murshed Chowdhury, Johann Alsmeier | 2021-12-07 |
| 11195781 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Teruo Okina, Akio Nishida | 2021-12-07 |
| 11127729 | Method for removing a bulk substrate from a bonded assembly of wafers | Murshed Chowdhury, Koichi Matsuno, Johann Alsmeier | 2021-09-21 |
| 11043455 | Three-dimensional memory device including self-aligned dielectric isolation regions for connection via structures and method of making the same | Johann Alsmeier, Jixin Yu | 2021-06-22 |
| 11037943 | Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same | Muneyuki Imai | 2021-06-15 |
| 11018153 | Three-dimensional memory device containing alternating stack of source layers and drain layers and vertical gate electrodes | Johann Alsmeier, Murshed Chowdhury | 2021-05-25 |
| 10985169 | Three-dimensional device with bonded structures including a support die and methods of making the same | Murshed Chowdhury, Koichi Matsuno, Johann Alsmeier | 2021-04-20 |
| 10950626 | Three-dimensional memory device containing alternating stack of source layers and drain layers and vertical gate electrodes | Johann Alsmeier, Murshed Chowdhury, Raiden Matsuno | 2021-03-16 |
| 10943917 | Three-dimensional memory device with drain-select-level isolation structures and method of making the same | Takaaki Iwai, Makoto Koto, Sayako Nagamine, Ching-Huang Lu, Wei Zhao +1 more | 2021-03-09 |