Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195857 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | James Kai, Ching-Huang Lu, Johann Alsmeier | 2021-12-07 |
| 11127729 | Method for removing a bulk substrate from a bonded assembly of wafers | James Kai, Koichi Matsuno, Johann Alsmeier | 2021-09-21 |
| 11018153 | Three-dimensional memory device containing alternating stack of source layers and drain layers and vertical gate electrodes | James Kai, Johann Alsmeier | 2021-05-25 |
| 10985169 | Three-dimensional device with bonded structures including a support die and methods of making the same | James Kai, Koichi Matsuno, Johann Alsmeier | 2021-04-20 |
| 10950626 | Three-dimensional memory device containing alternating stack of source layers and drain layers and vertical gate electrodes | James Kai, Johann Alsmeier, Raiden Matsuno | 2021-03-16 |