Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127729 | Method for removing a bulk substrate from a bonded assembly of wafers | James Kai, Murshed Chowdhury, Johann Alsmeier | 2021-09-21 |
| 10985169 | Three-dimensional device with bonded structures including a support die and methods of making the same | James Kai, Murshed Chowdhury, Johann Alsmeier | 2021-04-20 |