Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201107 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Akio Nishida, James Kai | 2021-12-14 |
| 11195781 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Akio Nishida, James Kai | 2021-12-07 |
| 11094704 | Method of forming a three-dimensional memory device and a driver circuit on opposite sides of a substrate | Yanli Zhang, Johann Alsmeier | 2021-08-17 |
| 11088076 | Bonding pads embedded in a dielectric diffusion barrier and having recessed metallic liners | — | 2021-08-10 |