Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991672 | Cu alloy bonding wire for semiconductor device | Tomohiro Uno, Takashi Yamada, Daizo Oda | 2021-04-27 |
| 10985130 | Cu alloy bonding wire for semiconductor device | Tomohiro Uno, Takashi Yamada, Daizo Oda | 2021-04-20 |
| 10950570 | Bonding wire for semiconductor device | Tomohiro Uno, Hiroyuki Deai | 2021-03-16 |
| 10950571 | Bonding wire for semiconductor device | Tomohiro Uno, Takashi Yamada, Daizo Oda, Motoki ETO | 2021-03-16 |