Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950571 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada, Daizo Oda | 2021-03-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950571 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada, Daizo Oda | 2021-03-16 |