Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101234 | Cu pillar cylindrical preform for semiconductor connection | Takashi Yamada, Teruo Haibara, Shinichi Terashima | 2021-08-24 |
| 10991672 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2021-04-27 |
| 10985130 | Cu alloy bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada | 2021-04-20 |
| 10950571 | Bonding wire for semiconductor device | Tetsuya OYAMADA, Tomohiro Uno, Takashi Yamada, Motoki ETO | 2021-03-16 |