Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11201107 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Teruo Okina, James Kai | 2021-12-14 |
| 11195781 | Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer | Teruo Okina, James Kai | 2021-12-07 |
| 11133297 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Fumiaki Toyama | 2021-09-28 |
| 11069703 | Three-dimensional device with bonded structures including a support die and methods of making the same | Mitsuteru Mushiga, Zhixin Cui | 2021-07-20 |
| 11011506 | Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same | Naohiro Hosoda, Kazuma Shimamoto, Tetsuya Shirasu, Yuji Fukano | 2021-05-18 |
| 10957680 | Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same | Shinsuke Yada, Masanori Tsutsumi, Sayako Nagamine, Yuji Fukano, Christopher J. Petti | 2021-03-23 |
| 10923496 | Three-dimensional memory device containing a replacement buried source line and methods of making the same | Mitsuteru Mushiga, Kenji Sugiura, Ryosuke Kaneko, Michiaki Sano | 2021-02-16 |
| 10923462 | Bifurcated memory die module semiconductor device | Toshiki Hirano, Gokul Kumar, Yan Li, Michael Mostovoy | 2021-02-16 |
| 10903164 | Bonded assembly including a semiconductor-on-insulator die and methods for making the same | — | 2021-01-26 |