Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152284 | Three-dimensional memory device with a dielectric isolation spacer and methods of forming the same | Jo SATO, Hisaya Sakai | 2021-10-19 |
| 10957680 | Semiconductor die stacking using vertical interconnection by through-dielectric via structures and methods for making the same | Shinsuke Yada, Sayako Nagamine, Yuji Fukano, Akio Nishida, Christopher J. Petti | 2021-03-23 |
| 10903222 | Three-dimensional memory device containing a carbon-doped source contact layer and methods for making the same | Kiyohiko Sakakibara, Masaaki Higashitani, Zhixin Cui | 2021-01-26 |
| 10903232 | Three-dimensional memory devices containing memory stack structures with laterally separated charge storage elements and method of making thereof | — | 2021-01-26 |