Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211370 | Bonded assembly with vertical power and control signal connection adjacent to sense amplifier regions and methods of forming the same | Jee-Yeon Kim, Yuki Mizutani | 2021-12-28 |
| 11139237 | Three-dimensional memory device containing horizontal and vertical word line interconnections and methods of forming the same | Shiqian Shao, Jee-Yeon Kim, Hirofumi TOKITA | 2021-10-05 |
| 11133297 | Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof | Kwang Ho Kim, Masaaki Higashitani, Akio Nishida | 2021-09-28 |
| 11114459 | Three-dimensional memory device containing width-modulated connection strips and methods of forming the same | Takaaki Iwai, Hirofumi TOKITA, Yoshitaka Otsu, Yuki Mizutani | 2021-09-07 |
| 11081443 | Multi-tier three-dimensional memory device containing dielectric well structures for contact via structures and methods of forming the same | Yuki Mizutani, Masayuki Hiroi | 2021-08-03 |
| 11011209 | Three-dimensional memory device including contact-level bit-line-connection structures and methods of making the same | Jee-Yeon Kim, Kwang Ho Kim, Yuki Mizutani | 2021-05-18 |
| 10991429 | Word line decoder circuitry under a three-dimensional memory array | Hiroyuki Ogawa, Takuya Ariki | 2021-04-27 |