Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011506 | Bonded structure including a performance-optimized support chip and a stress-optimized three-dimensional memory chip and method for making the same | Naohiro Hosoda, Tetsuya Shirasu, Yuji Fukano, Akio Nishida | 2021-05-18 |